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Contact Us GLOBAL Search this site 日本語 中文 Corporate Overview Products and Services Research and Development Sustainability News Corporate Overview Message from the Management Philosophy Quick Guide to JX Metals Business Segments Corporate Data Organization and Executive Officers Corporate History Operating Sites and Group Companies Long-Term Vision and Medium-Term Management Plan Purchasing Information Products and Services Search by Category Copper Alloys and Special Steel Products Copper Foil Sputtering Targets Compound Semiconductors and Crystal Materials Metal and Compound Powders Special Ceramic Powders High Purity Metals Surface Treatment Agents Upinorg (high-purity copper sulfate) Electroless UBM Plating Service MoSi2 Heater Shielding Materials Nonferrous Metals and Chemical Products Products Under Development Search by Keyword Semiconductors and Sensors Circuit Boards Assembly Displays Batteries and Energy Additive Manufacturing Connectors Magnetic Devices Electromagnetic Shielding Communications Optics Camera Modules Piezoelectricity Thermal Control Research and Development Our Core Technologies Contributing to Societal Growth and Innovation Initiatives for Co-creation Collaboration in the Group SQUARE LAB Sustainability Sustainability Report Toward Net-Zero CO2 Emissions Activities in Environmental Conservation CSR Purchasing News News Release Trade Fairs and Exhibitions MENU HOME Products and Services Copper Alloys and Special Steel Products Copper Alloy Foil Copper Alloys and Special Steel Products Copper Alloy Foil Pure copper foil Copper Alloy Foil Stainless steel Pure copper foil C1100R (tough pitch copper) HS1200 Sn-Cu-PET foil for electromagnetic shielding C1100R (tough pitch copper) Composition Thinnest manufacturable plate thickness (mm) Widest manufacturable plate width (mm) Mechanical properties Electrical conductivity (%IACS) Main features Applications Cu 99.90% or above 0.006 680 Tensile strength = 450MPa 101 Standard rolled copper foil FPC Lithium-ion battery negative-electrode material Electromagnetic shielding material HS1200 Composition Smallest manufacturable plate thickness (mm) Largest manufacturable plate width(mm) Mechanical properties Electrical conductivity (%IACS) Main features Applications Cu-0.12Sn 0.006 680 Tensile strength = 550MPa 90 High strength, high thermal resistance COF,TAB, Lithium-ion battery negative-electrode material Learn more Sn-Cu-PET foil for electromagnetic shielding Learn more Copper Alloy Foil Nickel Silver (C7521) Phosphor Bronze (C5210) Brass (C2600) C1990HP Foil (Titanium Copper Foil) Corson alloy (C7025) Nickel Silver (C7521) Composition Smallest manufacturable plate thickness (mm) Largest manufacturable plate width (mm) Mechanical properties Electrical conductivity (%IACS) Main features Applications 64Cu-18Ni-8Zn 0.020   H material Tensile strength &#8807; 540MPa Elongation &#8807; 3% 6 High corrosion resistance Spring material, shielding covers Phosphor Bronze (C5210) Composition Smallest manufacturable plate thickness (mm) Largest manufacturable plate width (mm) Mechanical properties Electrical conductivity (%IACS) Main features Applications 92Cu-8Sn 0.020 600 EH material Tensile strength = 685~785MPa Elongation &#8807; 11% 12 Excellent spring properties Spring material Learn more Brass (C2600) Composition Smallest manufacturable plate thickness (mm) Largest manufacturable plate width (mm) Mechanical properties Electrical conductivity (%IACS) Main features Applications 70Cu-30Zn 0.020 600 EH material Tensile strength &#8807; 520MPa 28 Ductility, electrical conductivity Piezoelectric buzzers C1990HP Foil (Titanium Copper Foil) Composition Smallest manufacturable plate thickness (mm) Largest manufacturable plate width (mm) Mechanical properties Electrical conductivity (%IACS) Main features Applications Cu-3.0Ti 0.030 450 XSH material Tensile strength = 1150MPa GSH material Tensile strength = 1400MPa 10 High strength, excellent spring properties Stress relaxation resistance Spring material Connectors Spring material in autofocus camera modules for mobile phones Learn more Corson alloy (C7025) Composition Smallest manufacturable plate thickness (mm) Largest manufacturable plate width (mm) Mechanical properties Electrical conductivity (%IACS) Main features Applications Cu-3.0Ni -0.65Si-0.15Mg 0.020 600 Tensile strength &#8806; 900MPa Elongation &#8806; 10% 45 High strength, high electrical conductivity Hard disk drive suspensions Interposers Learn more Stainless Steel Austenite (SUS301) Austenite (SUS304) Ferrite (SUS430) Austenite (SUS301) Composition Temper Smallest manufacturable plate thickness (mm) Largest manufacturable plate width (mm) Mechanical properties Specific resistance (n&#937;&#183;m) Main features Applications Fe-17Cr-7Ni BA 0.08~1.0 600 Tensile strength &#8807; 520MPa,Elongation &#8807; 40% 720 High strength High bend formability Switch parts 1/4H 0.075~0.95 600 Tensile strength &#8807; 650MPa,Elongation &#8807; 30% 1/2H 0.07~0.84 600 Tensile strength &#8807; 930MPa,Elongation &#8807; 10% 3/4H 0.06~0.74 600 Tensile strength &#8807; 1130MPa,Elongation &#8807; 5% H 0.05~0.6 600 Tensile strength &#8807; 1320MPa EH 0.045~0.35 600 Tensile strength &#8807; 1570MPa SEH 0.045~0.12 600 Tensile strength &#8807; 1740MPa Austenite (SUS304) Composition Temper Manufacturable thickness (mm) Largest manufacturable plate width (mm) Mechanical properties Specific resistance (n&#937;&#183;m) Main features Applications Fe-18Cr-8Ni BA 0.08~1.0 600 Tensile strength &#8807; 520MPa,Elongation &#8807; 40% 720 High strength Corrosion resistance Planar heating elements 1/4H 0.075~0.95 600 Tensile strength &#8807; 700MPa,Elongation &#8807; 35% 1/2H 0.071~0.89 600 Tensile strength &#8807; 780MPa,Elongation &#8807; 6% 3/4H 0.062~0.78 600 Tensile strength &#8807; 930MPa,Elongation &#8807; 3% H 0.05~0.62 600 Tensile strength &#8807; 1130MPa Ferrite (SUS430) Composition Temper Manufacturable thickness (mm) Largest manufacturable plate width (mm) Mechanical properties Specific resistance (n&#937;&#183;m) Main features Applications Fe-17Cr BA 0.08~0.95 600 Tensile strength &#8807; 450MPa,Elongation &#8807; 22% 600 Nonmagnetic, corrosion resistant Fluorescent display tube parts 1/4H 0.074~0.95 600 Tensile strength : 500~650MPa,Elongation : 15~25% 1/2H 0.068~0.85 600 Tensile strength : 600~800MPa,Elongation : 2~15% 3/4H 0.045~0.55 600 Tensile strength : 750~950MPa,Elongation &#8806; 5% H 0.045~0.25 600 Tensile strength &#8807; 900MPa Manufacturable plate thickness is dependent on the combination of thickness and requirements other than thickness (plate width, shape, etc.). Contact Information From the Web Contact Form Inquiries accepted 24 hours a day. Products and Services Products and Services TOP Search by Category Copper Alloys and Special Steel Products Copper Alloys and Special Steel Products TOP Copper Alloy Strip Copper Alloy Strip TOP Search for products Hyper Phosphor Bronze Hyper Phosphor Bronze TOP C5210 (HP) C5240 (HP) Titanium Copper Alloy Titanium Copper Alloy TOP C1990 C1990HP C1990HC NKT322 Corson Alloys Corson Alloys TOP C7025 NKC164 NKC164E NKC4419 NKC4820 NKC286 NKC286S NKC1816 NKC388 Phosphor Bronze Nickel Silver High Conductivity Alloys High Conductivity Alloys TOP NKE010 NKE012 Copper Alloy Foil Copper Alloy Foil TOP HS1200 Sn-Cu-PET foil for electromagnetic shielding C1990HP Foil (Titanium Copper Foil) Special Steel Products Special Steel Products TOP List of Properties Copper Foil Copper Foil TOP Treated Rolled Copper Foil Treated Rolled Copper Foil TOP HA and HA-V2 foil Surface Treatment JXEFL Series Electro-Deposited Copper Foil for Flexible Printed Circuits Copper Foil for Rigid Circuit Boards Sputtering Targets Sputtering Targets TOP What Is Sputtering? Sputtering Targets for Semiconductors AlSc Sputtering Target Sputtering Targets for Flat Panel Displays Sputtering Targets for Flat Panel Displays TOP ITO Sputtering Target IZO Sputtering Target IGZO Sputtering Target Sputtering Targets for Optical Films Sputtering Targets for Optical Films TOP NS-LR Series (Low-Refractivity Target) NS-5 Series (High-Refractivity Target) Sputtering Targets for Magnetic Devices Sputtering Targets for Photovoltaic Cells Compound Semiconductors and Crystal Materials Compound Semiconductors and Crystal Materials TOP Compound Semiconductor Substrates-InP, CdZnTe (CdTe)- Strontium Titanate (SrTiO3) Rutile Titanium Dioxide (TiO2) Metal and Compound Powders Metal and Compound Powders TOP Tantalum and Niobium Materials High Purity Chlorides Metal Powders for Additive Manufacturing Other Metal Powders Special Ceramic Powders Special Ceramic Powders TOP Negative Thermal Expansion Material ZrW2O8 High Purity Metals High Purity Metals TOP High Purity Metals Low &#945; Tin Surface Treatment Agents Upinorg (high-purity copper sulfate) Electroless UBM Plating Service MoSi2 Heater Shielding Materials Shielding Materials TOP 3D formable Sheets for Electromagnetic Shielding(Mighty Shield®) Nonferrous Metals and Chemical Products Nonferrous Metals and Chemical Products TOP Refined Copper/Copper Cakes and Billets Precious Metals Rare Metals Sulfuric acid, slag, gypsum, etc. Products Under Development Products Under Development TOP Special Ceramic Powders 3D formable Sheets for Electromagnetic Shielding(Mighty Shield®) Metal Powders for Additive Manufacturing High Purity Chlorides Lead-free Piezoelectric Powder Material AlSc Sputtering Target YAG Ceramics for Laser Applications Magnesium silicide (Mg2Si) Single Crystal for Infrared Detector Search by Keyword Semiconductors and Sensors Semiconductors and Sensors TOP Copper Alloys for Lead Frames Circuit Boards Circuit Boards TOP High Strength Copper Alloys for Sockets Assembly Displays Batteries and Energy Additive Manufacturing Connectors Connectors TOP Copper Alloys for Board to Board Connectors Copper Alloys for FPC Connectors Copper Alloys for Backplane Connectors Alloys for Floating Connectors Copper Alloys for SIM Card Connectors Copper Alloys for USB Connectors Copper Alloys for Harness Connectors Magnetic Devices Electromagnetic Shielding Communications Optics Camera Modules Piezoelectricity Thermal Control Thermal Control TOP Copper Alloys for Cooling Modules Menu Contact Us Search Sitemap Page Up Corporate Overview Message from the Management Philosophy Quick Guide to JX Metals Corporation Business Segments Corporate Data Organization and Executive Officers Corporate History Operating Sites and Group Companies Long-Term Vision and Medium-Term Management Plan Purchasing Information Products and Services Search by Category Search by Keyword Research and Development Our Core Technologies Contributing to Societal Growth and Innovation Initiatives for Co-creation Collaboration in the Group SQUARE LAB Sustainability Sustainability Report Toward Net-Zero CO2 Emissions Activities in Environmental Conservation CSR Purchasing News News Release Trade Fairs and Exhibitions Close Page Up Corporate Overview Products and Services Research and Development Sustainability News Privacy Policy Terms of Use Sitemap COOKIE 設定 Copyright © JX Metals Corporation All Rights Reserved.

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